The Snapdragon 765 is a pretty great chip, combining a selection of high-end features from Qualcomm’s 800 Series with a lower price, which puts it at the higher end of the mid-range. According to an alleged Telegram leak, the next upgrade to this class will be significant. The biggest change to the Snapdragon 775 is the move to a smaller and more efficient 5-nanometer manufacturing process, as seen on the 888.
The leak of the Telegram “XiaomiUI”
Hardware comparison between SM7250 (Snapdragon 765) and SM7350 (Snapdragon 775), bold upgrades.
This unconfirmed hardware would make the 5nm Snapdragon 775 almost as powerful as the 7nm 870, and potentially better in some areas such as memory speed and multi-camera performance. It would not be able to go heel to toe with the 888, but then it would not be necessary – it would be used in much cheaper devices. Given that important details such as the CPU model and GPU are missing, and assuming this is a real leak, it can take a long time for SoC to appear on devices.